The Heater Block Upgrade, developed by the OEM Group, features an Upgraded Circular Groove Heater Block which contains both an embedded heating element and supplementary horizontal grooves. The embedded heating element provides improved heating uniformity and more rapid strip rate and eliminates the need for ancillary components such as AC Power Supply Leads and Pusher Bars. The horizontal grooves enhance the wafer handling surface to further minimize the risk of wafer sliding.

Upgraded Heater Block Assembly
Functional Temperature Range: 90C – 250C
Top Plate
Material: Aluminum
Anodization: Hard Anodize, Clear, .002” - .004” THK
Surface Grooves: 50 vertical, 10 Circular, 9 Horizontal
Cooling Holes: 140 running through top & bottom plates
Bottom Plate
Material: 6061-T6 Aluminum Alloy
Heating Element:
• Press-fitted into bottom plate surface channel
• Current Draw: 15 amps (+/- 3)
• Resistance: 15 ohms
• Power: 3 kW
Power Supply Leads:
• Two stainless steel wires (Teflon protected)
• Eyelet connector
• Input Voltage: 120 – 208 VAC
Upgraded Thermocouples
• Specifically designed for Upgraded Heater Block
• New Contact Leads screw into Heater Block base
• Spring-loaded TC Probe inserted into base of Contact Lead

Features & Benefits:
Easy drop in replacement
• Lower cost of ownership
2-Piece Construction
• Improved wafer ash uniformity
• Faster temperature response (ready for process)
• Allows for improved wafer throughput
• Wider operating temperature range 90C – 250C, with less than 1C temperature drift
Direct contact Upgraded Thermocouple
• Accurate temperature measurement and control
• Improved temperature uniformity
Improved Manufacturing
• Focused on extended life and enhanced product performance