The Aspen II Ash consists of the standard Aspen platform together with one or two processing chambers. Each chamber processes two wafers at a time. System throughput varies with the resist thickness and is approximately 60-120 wafers per hour with one chamber and 110-160 wafers per hour with two chambers for most applications.

The two chamber Aspen Ash offers a substantial reduction in COO relative to conventional single wafer systems. Systems achieve substantial improvements in throughput which result in a substantial reduction in COO and allow users to reduce wet chemical steps, which makes it possible to achieve an even greater reduction in COO by decreasing the number of systems needed.