EndeavorEUV™ Substrate Size: 6" x 6" Reticle

The EndeavorEUV™ cluster tool is a state-of-the-art platform for advanced PVD of buffer, absorber, and anti-reflective layer thin films for EUVL photomasks up to 150mm square. The keys to EUVL mask making are critical film quality control and ultra-clean, low defect deposition. Patented S-Gun™ reactive sputtering modules deliver superior results on a the production proven Endeavor cluster tool. SMIF compatible, the transport system is designed for edge-only reticle handling and the unique "sputter-up" configuration allows processing without any contact to the reticle 's front or back faces. No other platform offers this unique solution for ultra low particle performance.

Endeavor™ and EndeavorEUV™ are trademarks of OEM Group, Inc.