Cintillio SAT Batch Spray Acid Technology

Cintillio CPT

Cintillio SAT Batch Spray Introduction

Leveraging an innovative enhanced spray technology Cintillio SAT offers wet-chemical processing to meet most any application demand. Cintillio SAT processes multiple wafer sizes with one carrier change.  With the smallest footprint (12 sq ft) among similar equipment, Cintillio SAT not only saves fab-floor real estate, it also enables high up-time and low CoO.

Applications:

  • Metal etch, Oxide etch, GaAS etch (recess etch)
  • UBM etch, Cu etch, Cu rework
  • Polymer removal, photo-resist strip

Specifications:

  • B&R Industrial PLC, motor controller and PC
  • Pilz programmable EMO circuit
  • Rotary encoder for RPM monitoring and control
  • SMC solenoids via bus-interface
  • Eddysonic Vortex flow meter for standard applications
  • Process-critical items manufactured by OEM Group to ensure integrity

Features and Benefits

  • 25- and 50- wafer batch process – high throughput and semi-automated
  • Reduced drag out and chemical & DI water consumption mean low cost of ownership
  • Flexible chemical configurations – up to 4 chemical tanks
  • Component s are universal across Cintillio platforms
  • Modular construction and service-friendly design, replaces large wet benches by 1/10th of required footprint
  • SAT can be configured with up to four onboard chemical tanks, external support of chemical delivery units (CDUs), external O3 generators for
  • Ozone processes and 25- or 50-wafer process loads

EST Enhanced Spray Technology:

  • Delivers process improvement through uniform media flow
  • Nozzle-per-wafer concept ensures:
    • Uniform flow
    • Increased rinse efficiency

Cintillio SOT Batch Spray Ozone Tool

Other Cintillio CPT Models

Cintillio SST Batch Spray Solvent Tool

Cintillio Spray Solvent Tool

Cintillio SOT Batch Spray Ozone Tool

Cintillio Spray Ozone Tool