Cintillio S Automated Batch Wafer Surface Preparation System

Cintillio CPT

Cintillio S System Introduction

The Cintillio S is a state-of-the-art automated batch wafer surface preparation platform featuring high throughput and preciss process control. The Cintillio S platform provides solutions for FEOL and BEOL manufacturing, as well as wafer scale packaging.

Process Applications:

  • Solvent:
    • Resist Strip
    • Resist De-scum
    • Polymer removal
    • High Density Implant Resist Strip
  • Acid:
    • Prediffusion clean
    • Post-ash clean, Post-CMP clean
    • ONO etch, UBM etch, Metal etch
    • Polymer removal
    • Photoresist strip
    • Wafer reclaim
  • Cintillio S:
    • Prediffusion clean, Critical clean
    • Post-ash clean, Post-CMP clean
    • ONO etch
    • Polymer removal
    • Photoresist strip
    • Ozone Processing
    • Wafer reclaim

Features:

  • Up to four (4) separate on-board chemical and mixing processes
  • Modular compact, efficient footprint
  • Reduced chemical and water usage
  • Reduce cycle times
  • Single or multiple process modules
  • Low exhaust/emissions
  • 150mm to 300mm wafer processing
  • Low cost of ownership

Benefits:

  • High productivity
  • Flexibility
  • Robust automation
  • Advanced process control

Cintillio S

Other Cintillio CPT Models

Cintillio SST Batch Spray Solvent Tool

Cintillio Spray Solvent Tool

Cintillio SOT Batch Spray Ozone Tool

Cintillio Spray Ozone Tool