The AGHeatpulse 8800 is designed to meet device manufacturers’ advanced rapid thermal processing needs. This cassette-to-cassette system is the industry’s lowest cost of ownership RTP solution. Superior process results and high throughput are achieved within a small footprint - with the reliability you expect from a AGHeatpulse product. OEM Group is the exclusive OEM-licensed manufacturer of the AGHeatpulse 8800.

Superior Process Control—Improved Yield
• Single wafer, closed-loop temperature and power control with per-lamp power modules
• Automatic susceptor loading confi guration for exotic substrate processing

Advanced Temperature Measurement and Control
• Pyrometer or ez-DTC temperature control with redundant backup for consistent processing
• Emissivity independent control with optional ceramic shield

High Productivity
• N2 curtain, low mass quartz and fast chamber purge for rapid process gas changes
• Continuous pick-and-place wafer processing

Integrated Applications
• Silicon, GaAs, and compound substrates
• Implant activation & anneal
• Thermal oxidation / nitridation
• Metal silicidation (Ti, Co, Ni)
• Low-K dielectric anneal
• Gate anneal
• Glass flow / reflow
• SOG densification